Technical Package Product Manager & Member of Technical Staff - Micron Technology

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In the role of a Technical Package Product Manager & Member of Technical Staff at Micron, you will be at the forefront of innovation in memory package development. Your expertise will be crucial in developing the next generations of low power product solutions for the world’s leading providers of handheld and mobile solutions. 

Your responsibilities include collaborating with customers on their package product requirements and solutions; defining test vehicles to deliver the necessary advanced package design rules, new materials and integrations; and providing consultation on package design, thermal, electrical, mechanical, reliability, and cost considerations.

You will work with a diverse cross-functional team in Micron.  Your role will contribute to the synergy between product market development, die and package design, and chip to package interactions, ensuring they are seamlessly integrated with assembly, testing, manufacturing, and global quality standards. This role offers the unique opportunity to engage with senior executives in shaping the development of cutting-edge packaging technologies.

Responsibilities include, but are not limited to:

• Engaging customers in systems requirements for end application and translating into package product technical requirements definition (thermal, mechanical, reliability and aspects of electrical).
• Defining memory package design rule roadmap for wirebond stacked memory applications.  Including rules to achieve reliability requirements, Chip-Package-Interaction (CPI), substrate design, die stacking and materials.
• Leading a design and development team for test vehicle design and execution to achieve roadmap requirements and validation ahead of go-to-market product timelines.
• Leading a cross-functional design and development team to achieve revenue package products on schedule by influencing design attributes, materials selection, die fit studies, cost analysis and reliability requirements. 
• Collaborating with Business, Product Engineering and field teams to guide package products from concept to mass production. 

Successful candidates for this position will have:

• Proven leadership in leading cross-functional teams to achieve timely technical goals while maintaining a high standard of excellence.
• A keen understanding of mobile packaged product solutions (Discrete, PoP, FOP, InFo, MEP) and their system integrations.
• Excellent communication skills.
• Skilled in interpreting complex design and simulation data across multiple engineering domains.

Required Experience:

• Degree in Physics, Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering; advanced degrees (MS, PhD) are preferred.
• A minimum of 10 years of experience in related field.
• Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring. 

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$129,000.00 - $349,000.00

Our salary ranges are determined by role, level, and location.  The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations.  Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training.  The pay scale is subject to change depending on business needs.  Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.