Senior Microelectronics Design Engineer - Leidos

Description

The Electronic Warfare (EW) Division is a 430-employee research and development organization in the Leidos Innovations Center (LInC).  The EW Division is at the forefront of researching, designing, and developing EW systems, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies for our nation’s defense.

The EW Division has an opening for a Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions.  Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.

Primary Responsibilities

• The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base’s (DIB) access to trusted, state-of-the-art microelectronics.

• Lead or support marketing and business development initiatives: develop technical solutions and new ideas for response to capture efforts (e.g., BAAs, RFPs etc.)

• Lead a microelectonics design team to design, integrate and test challenging DSP FPGA designs for EW sensor systems.

• This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country..

• Provide occasional technical support and/or field support planning, and other field support in general if needed.

• Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.

• Interact with outside customers, suppliers, and functional peer groups.

• Some travel and work at remote sites for limited time periods may be occasionally required.

• Communicate results in briefings and written material to your team, the Customer and management

• Provides technical advice/input that impact strategic client outputs and Leidos business results.

• Impacts functional strategy by developing new solutions, processes, standards or operational plans that position Leidos competitively in the marketplace.

• Mentors and coaches other technical staff.

• Serve as Principal Investigator on complex multi-disciplinary programs that typically include field demonstration of real-time hardware systems.

• Serve as Technical Lead on complex multi-disciplinary proposals.

• Some travel and work at remote sites for limited time periods may be occasionally required.

Basic Qualifications

• Masters with 15+ years prior relevant experience or Doctorate with 13+ years prior relevant experience.

• Must be a U.S. Citizenship with the ability to obtain a TS//SCI level clearance.

• Demonstrated leadership of complex multi-disciplinary technical teams and/or projects.

• Demonstrated strong oral and written communication.

• Experience with DSP fundamentals and FPGA implementation

• Experience with Matlab/Simulink

• Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.)

• Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:

• Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)

• Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)

• Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)

• Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)

Preferred Qualifications

• Doctoral degree in Electrical Engineering or related.

• Idea creation and program capture experience (proposals, white papers, etc.).

• Experience working in a fast-paced Research and Development (R&D) environment.

• Active TS or TS//SCI clearance.

LInC

Electronic Warfare

While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $148,850.00 - $269,075.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.