Senior Manager I, Americas Field Application Engineer at Kulicke and Soffa Industries, Inc.

Senior Manager I, Americas Field Application Engineer (Kulicke and Soffa Industries, Inc.) (Fort Washington, PA): Serve as an internal expert resource on thermocompression flip-chip topics for K&S staff members and as a principle technical interface for customers’ engineering team members and other stakeholders; Establish a deep technical working partnership with customers to optimize processes and drive problem resolution, communicating status and progress to the customer on a daily basis; Develop and optimize processes, components, and techniques for thermocompression bonding systems; Carry out product and systems testing to ensure equipment and components are functioning consistently with internal design expectations and customer-expected performance; Be an internal expert on current and future customer needs to provide guidance and detailed information for future design/software iterations and new machine developments; Collect additional customer requirements for future functionality, which can subsequently be translated into specific design/engineering action items for further product refinement; Conduct detailed evaluations to determine the nature and source of any issue which prevents systems from functioning as intended; Carry out performance and design data evaluation to prepare internal technical summary reports and to generate additional information for use in internal and customer presentations; and Coordinate and provide training to the Field Application and junior Process Engineers, Monitor FAE and Process Engineer performance and provide performance reviews, and guide their daily activities, especially when technical issues arise that are beyond their technical knowledge. Must have the following skills and experience in order to complete the above-mentioned tasks: Deep understanding of the thermocompression flip chip processes; Experience with detailed application tech processes and the function of the 100+ parameters that affect good and robust bonding (simultaneous soldering of tens of thousands of electrical interconnects on a single chip with micro-meter level accuracy); Ability to troubleshoot highly complex semiconductor equipment and their processes to identify causes of poor bonding performance or occasional production stoppages through understanding of the machine as a system, including its mechanical, electrical and software components; and Excellent technical communication skills. Requires a Bachelor's degree or foreign equivalent in Mechanical or Semiconductor Engineering or related field and at least 5 years of experience as a Semiconductor Packaging Engineer, Researcher, or related occupation. Travel required: 25% in the US, Central America, and Asia. Salary: $186,000.00 - $205,000.00 per year. Please send C.V. to amcgrath@kns.com. 

#LI-DNI