Production Specialist - Wafer Fabrication - 2nd Shift at Donatech Corporation
Goleta, CA
About the Job
Position would require the candidate to be a W2 employee of Donatech
US Citizenship Required
This is a second shift role (12-8:30PM). Note: training period may or may not occur on 1st shift ~6:30AM-3:00PM.
What is the primary mission of this role? Production Operations
• What are the main functions of this role?
o A Production Specialist In the Wafer Area operates equipment and performs processes to build hardware. Utilizes their advanced processing experience to multitask and has the ability to trouble shoot, resolve issues working with production support teams. Rigorously documents processes performed in electronic tracking systems. Executes tasks to ensure that equipment and processes being used are in control. May assist in directing work, outlining tasks and checking other’s work for correctness. This is a 100% onsite position.
o Positions are on second shift; however, training may be on 1st shift for the entire contract period because the employee must establish the required certifications to move to their final designated shift hours. Candidates need this shift hours flexibility during their contract period.
First Shift ~6:30AM – 3PM in Goleta, California
Second Shift ~12:00PM – 8:30PM in Goleta, California
• Required Skill Sets:
o High School Diploma or GED
o Minimum 6 years of production experience in cleanroom wafer fabrication.
o Has experience in MS Office (Excel)
o The ability to work in a class 100 cleanroom, in a full bunny suit, under yellow lights
o Operation of semiconductor style equipment (coat, expose, develop, wet etch, hotplate, surface treatment, deposition, metrology, inspection tools) to build hardware.
o Following written procedures and work instructions
o Handling fragile hardware and manually manipulate small parts during processing.
o Documenting data on travelers and in the electronic database
o Utilize strong interpersonal communication skills with peers, support teams and management.
o Cross-training will be on going and requires the ability to learn new processes, equipment, techniques through guidance and direction from their trainers. Routine work is performed without supervision.
• Desired Skill Sets:
o More than six years of production experience in cleanroom wafer fabrication
o Experience in Photolithography, Wet Etch, Deposition
o Ability to work safely with chemicals and raw production materials.
o Ability to multitask.
o The flexibility to work occasional, voluntary overtime on weekends to meet the factory’s needs is strongly desired.
• Years of Experience Required (if any): Minimum 6 years of production experience in cleanroom wafer fabrication.
• Education Level Required: High School Diploma or GED
• How will the contractor’s success be measured?: Success will be measured of both Technical and Behavioral Skills. Technical skills include successful completion of required process certifications, execution of tasks provided in job description versus error rate*** Behavior includes the utilization of work-related behavioral competencies while executing job tasks (Teamwork and collaboration, ability to schedule, manage time, prioritize, leverage resources and candidates’ engagement in area objectives). Contractor’s attendance record during the contract period is also factored into performance within the behavior competencies.
US Citizenship Required
This is a second shift role (12-8:30PM). Note: training period may or may not occur on 1st shift ~6:30AM-3:00PM.
What is the primary mission of this role? Production Operations
• What are the main functions of this role?
o A Production Specialist In the Wafer Area operates equipment and performs processes to build hardware. Utilizes their advanced processing experience to multitask and has the ability to trouble shoot, resolve issues working with production support teams. Rigorously documents processes performed in electronic tracking systems. Executes tasks to ensure that equipment and processes being used are in control. May assist in directing work, outlining tasks and checking other’s work for correctness. This is a 100% onsite position.
o Positions are on second shift; however, training may be on 1st shift for the entire contract period because the employee must establish the required certifications to move to their final designated shift hours. Candidates need this shift hours flexibility during their contract period.
First Shift ~6:30AM – 3PM in Goleta, California
Second Shift ~12:00PM – 8:30PM in Goleta, California
• Required Skill Sets:
o High School Diploma or GED
o Minimum 6 years of production experience in cleanroom wafer fabrication.
o Has experience in MS Office (Excel)
o The ability to work in a class 100 cleanroom, in a full bunny suit, under yellow lights
o Operation of semiconductor style equipment (coat, expose, develop, wet etch, hotplate, surface treatment, deposition, metrology, inspection tools) to build hardware.
o Following written procedures and work instructions
o Handling fragile hardware and manually manipulate small parts during processing.
o Documenting data on travelers and in the electronic database
o Utilize strong interpersonal communication skills with peers, support teams and management.
o Cross-training will be on going and requires the ability to learn new processes, equipment, techniques through guidance and direction from their trainers. Routine work is performed without supervision.
• Desired Skill Sets:
o More than six years of production experience in cleanroom wafer fabrication
o Experience in Photolithography, Wet Etch, Deposition
o Ability to work safely with chemicals and raw production materials.
o Ability to multitask.
o The flexibility to work occasional, voluntary overtime on weekends to meet the factory’s needs is strongly desired.
• Years of Experience Required (if any): Minimum 6 years of production experience in cleanroom wafer fabrication.
• Education Level Required: High School Diploma or GED
• How will the contractor’s success be measured?: Success will be measured of both Technical and Behavioral Skills. Technical skills include successful completion of required process certifications, execution of tasks provided in job description versus error rate*** Behavior includes the utilization of work-related behavioral competencies while executing job tasks (Teamwork and collaboration, ability to schedule, manage time, prioritize, leverage resources and candidates’ engagement in area objectives). Contractor’s attendance record during the contract period is also factored into performance within the behavior competencies.