Process Integration Engineer - Advanced Packaging - Micron Technology

Have you ever dreamed of contributing to the development of groundbreaking technologies? Micron has an outstanding opportunity for a high energy, tenacious, ambitious, results driven individual with a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho.

As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build program plans, and secure resources to drive process technology development programs. More specifically, develop sophisticated interconnect technology solutions that include wafer to wafer bonding, using Hybrid Bonding, or Fusion bonding. You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes. You will take ownership of these programs or projects through to deployment of technology nodes into our High-Volume Manufacturing (HVM) operations. You will develop a yield improvement and process margin improvement roadmap to ensure extended engagement with manufacturing to insure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with alignment of leaders and partners and demonstrate the ability to guide individuals towards project objectives. You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. You will need to embrace change and volatility and operate with a sense of urgency. Apply sound engineering principles and judgement, seek advice from experts and make critical and timely decisions. You will need to advise and lead the work of others and ensure good communication, engagement and accountability leading to achievement of the program goals.

Responsibilities and Duties include, but not limited to:

Line Monitoring

• Project management
• Yield improvement
• Developing new line monitoring methods and processes
• Data mining
• Determining critical metrics for line monitoring
• Use Micron systems for conducting experimental work and documenting outcomes
• Analysis of results from experiments and providing clear and practical recommendations or decisions
• Writing Engineering Change Notices and Change Management Documents (ECN and GCP)

Leading problem-solving activities

• Perform Kempner-Tregoe (KT) or KT-like problem solving and decision-making process
• Define and execute Design of Experiment (DoE)
• Communications - same site and site-to-site
• Present to others

Coordinating conversion timelines

Develop and innovate, establish contingency plans

• Drive process innovation for best in class solutions and cost driven technology
• Vertical integration capability to define highly complex process flow
• Focus on reliability and a “shift left” mentality and approach to technology development

Coaching & Mentoring

• Coaching and mentoring early and mid-career engineers (E1-E3) and technicians
• Instructing classes as needed

Growth Mindset

• Continue to build new skills through development goals and learning events
• Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Qualifications and Skills

• At least 5 years experience in advanced packaging industry
• Degree/Major: MS or Ph.D. in Electrical, Computer Engineering, Chemistry, Physic, Material or related field
• Deep knowledge advanced package integration and DRAM or other memory. (3DIC, FO, Hybrid bond...etc)
• Excellent data extraction, analysis and reporting skills. (System analytics, JMP…etc)
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities
• Successfully demonstrated collaboration skills with a focus on developing good team dynamics
• Skill at effectively prioritizing multiple and sophisticated tasks.
• Good communication skill to align the perspective through multi-functional teams
• Tenacity to work effectively under tight timelines and limited resources
• Ability to self-direct and measure with minimal direction
• Fluent communication in English