Principle Mechanical Packaging Engineer - DLM Professional
Cambridge, MA 02139
About the Job
We are looking for a highly experienced mechanical design engineer to join our team as a Principal Mechanical Packaging Engineer. In this role, you will be responsible for developing solutions to complex problems related to electronics packaging and leading technical teams to accomplish program goals. You will leverage state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies, including technologies such as System in Package (SiP), Multichip Module (MCM), Chip-on-board (COB), and high-density interconnect PCBs.
Responsibilities:
- Drive ideation activities for initial system conceptualization
- Develop system requirements and propose ways forward when customer requirements are unclear or incomplete
- Build and test prototype hardware
- Perform mechanical design and development associated with the physical arrangement of electronic circuits
- Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles
- Communicate effectively with multi-disciplinary program team members and program leadership, senior management, and sponsors
- Lead technical teams of 6 or more people to accomplish program goals
- Identify, manage, and control technical and schedule risks associated with a design decision and communicate them to project leadership and customers or stakeholders
- Produce or oversee the production of fully released Technical Data Packages
- Strong organization, planning, and time management skills to achieve program goals
Required Qualifications:
- Bachelor of Science degree with 15+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
- Master of Science degree with 10+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
- Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
- Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
- Experience with 3D CAD, specifically CREO and/or Solidworks
- Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles
- Experience with fabrication and assembly of prototypes and proof-of-concept models
Preferred Qualifications:
- Experience with machine shop tools and processes, prototyping, and vendor coordination
- Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high-density substrates, rigid-flex designs, and integrated circuit assembly
Security Clearance:
Current in-scope TOP SECRET security clearance is required.
Why is This a Great Opportunity:
This is an excellent opportunity for a senior-level mechanical design engineer with a passion for electronics packaging to join a dynamic team working on cutting-edge technologies. You will be working on highly integrated hardware that meets shrinking form-factors and increasing thermal loads, using state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies. You will also have the opportunity to lead technical teams and drive the ideation and development of advanced systems.
Responsibilities:
- Drive ideation activities for initial system conceptualization
- Develop system requirements and propose ways forward when customer requirements are unclear or incomplete
- Build and test prototype hardware
- Perform mechanical design and development associated with the physical arrangement of electronic circuits
- Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles
- Communicate effectively with multi-disciplinary program team members and program leadership, senior management, and sponsors
- Lead technical teams of 6 or more people to accomplish program goals
- Identify, manage, and control technical and schedule risks associated with a design decision and communicate them to project leadership and customers or stakeholders
- Produce or oversee the production of fully released Technical Data Packages
- Strong organization, planning, and time management skills to achieve program goals
Required Qualifications:
- Bachelor of Science degree with 15+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
- Master of Science degree with 10+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
- Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
- Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
- Experience with 3D CAD, specifically CREO and/or Solidworks
- Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles
- Experience with fabrication and assembly of prototypes and proof-of-concept models
Preferred Qualifications:
- Experience with machine shop tools and processes, prototyping, and vendor coordination
- Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high-density substrates, rigid-flex designs, and integrated circuit assembly
Security Clearance:
Current in-scope TOP SECRET security clearance is required.
Why is This a Great Opportunity:
This is an excellent opportunity for a senior-level mechanical design engineer with a passion for electronics packaging to join a dynamic team working on cutting-edge technologies. You will be working on highly integrated hardware that meets shrinking form-factors and increasing thermal loads, using state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies. You will also have the opportunity to lead technical teams and drive the ideation and development of advanced systems.
Source : DLM Professional