Principal Engineer - 2.5D/3D Process Development - Celestial AI

Job Description:

In this role you will utilize your in-depth 2.5D assembly process experience and partner management experience to drive company's AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly development along with strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency.

 ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Work with cross-functional packaging teams and lead TSV, backend stack development at the foundry along with 2.5D/3D CoW process development at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies
• Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
• Manage internal and external resources effectively and efficiently towards established corporate milestones
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

QUALIFICATIONS:

• 15+ years of experience in Semiconductor Packaging, Process and Technology Development
• Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies is required
• Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors
• Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required
• Working level understanding of cross-functional packaging areas:  package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost
• Familiarity with component & system level reliability, testing, and FA
• Experience with photonics packaging will be preferred but is not necessary
• Experience in project management and communicating technical and project/program status and issue resolution at the executive level
• Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
• Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
• Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
• M.S or Ph.D. in Mechanical Engineering, Materials Science or Physics is required

Location: Bay area location is required.

For California location:

As an early startup experiencing explosive growth, we offer an extremely attractive total compensation package, inclusive of competitive base salary and a generous grant of our valuable early-stage equity.  The target base salary for this role is approximately $160,000.00 - $190,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.