Manufacturing Engineering from American Cybersystems

Job Description:

• Development of printed circuit board assembly strategies for new and existing products including process design and development, integration of automated solutions, and process documentation.
• Utilize SMT equipment and process knowledge to identify quality and throughput improvement opportunities and implement solutions to realize these improvements.
• Estimate manufacturing costs, determine time standards, and make recommendations for tooling and process requirements of new or existing product lines.
• Support assembly processes for existing products, including implementation of design changes, process improvements, and root cause corrective actions.
• Interface with manufacturing, engineering, vendor and subcontractor representatives to ensure requirements are met.
• Support Design for Assembly and Design for Manufacturing efforts to drive product and process improvements
• Standard use of e3 / Lean Six Sigma philosophy/tools for ongoing improvements. Support development and implementation of quality metrics to drive improvement and business results
• Support production validation builds on new processes and implements modifications based on feedback
• SMT (Solder Paste Print, Pick and Place, Reflow) process knowledge of high reliability electronics, including BGA, micro BGA, CSP, and QFN components
• Strong math, computer and problem-solving skills
• Collaborate with Operations, Planning, Engineering and Quality organizations to solve problems in a fast paced environment.
• Structured thinker with high detail orientation.
• Experience with IPC workmanship standards, including IPC-A-610 and J-STD-001
• Ability to support Transfer of Technology (Production)
• Position may require travel overseas to support Transfer of Technology projects

Education and Experience Requirements:

• Bachelor’s Degree and min. 4 years of prior relevant experience.