Manufacturing Engineer from American Cybersystems

Job Description:

• SMT (Solder Paste Print, Pick and Place, Reflow) process knowledge of high reliability electronics, including BGA, micro BGA, CSP, and QFN components
• Strong math, computer and problem-solving skills
• Collaborate with Operations, Planning, Engineering and Quality organizations to solve problems in a fast paced environment.
• Structured thinker with high detail orientation.
• Experience with IPC workmanship standards, including IPC-A-610 and J-STD-001
• Interpersonal communication skills and ability to work in a team environment required
• Effective oral and written communication skills
• Self-starter and able to work successfully with minimal supervision

Education and Experience Requirements:

• Bachelor’s Degree and min. 4 years of prior relevant experience.