Engineering Manager - Engineering Resource Group

Description

• Permanent position for an Engineering Manager who has overall engineering design and development responsibility for microelectronic component preparation services.
• Work with the leadership team to develop strategy, lead continuous improvement efforts, and manage performance standards.
• Provide strategic development, guidance, direction and oversight to an engineering team.
• Plan and coordinate daily activities, and meet performance expectations.
• Implement policies and objectives to increase productivity and maximize return on investments.
• Provide mentorship and coaching to enhance individual and organizational technical knowledge and capabilities.
• Develop and expand manufacturing processes and services.
• Lead, take charge, and offer opinions and direction.
• Conceive, direct, plan, and implement new equipment and solder finishing processes to increase automation, productivity, and maximize return on capital investments.
• Create, design, & source process equipment tooling, dies, & component handling devices.
• Establish manufacturing and processing design standards.
• Research equipment, supplies, & technologies to evaluate best-in-class processing solutions,
• Research emergent semiconductor process technologies and impart into business.
• Coordinate w/ Sales, Quality, Engineering, & Production to comprehend customer make-to-order quote requests & determine ability to comply with customer specifications.
• Resolve conflicts between customer requirements and company capabilities to ensure alignment with capabilities to RFQ’s.
• Provide applications support to customer.
• Facilitate audits and technical exchanges with customers.
• Conduct product validations on custom make-to-order requirements.

Requirements

• BS Materials Science or Mechanical Engineering
• Knowledge of SnPb solder,SAC305 solder, and robotic hot solder dip processes.
• Minimum 5 years of experience in related semiconductor assembly and/or PCB assembly operations.
• Managerial experience with semiconductor packaging technologies.
• Working knowledge of GEIA-STD-0006, MIL-STD-883, AS9100, ISO quality standards.
• Demonstrated working knowledge and use of quality tools: DOE, PFMEA, SPC, etc.
• Working knowledge of Solidworks and related engineering 3D design / CAD tools.
• Established written and verbal communications skills.
• Senior management level experience in a low volume, high mix build to print or contract manufacturing environment.
• Experience managing growth in a technical environment, preferably from within the defense and aerospace industries.
• Demonstrated ability to develop constructive, long-term customer and supplier relationships.

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